Sealing glue 密封胶

1.Control cables
2.Electrical
3.Valves, packings, seals & O-rings

1.UL 94 V-0 certified
2.Dual component
3.Heat cured
4.Self-leveling

1.Quick deep section cure
2.UL 94 V-0 certified
3.Dual component
4.10:1 mix ratio
5.Room-temperature cure
6.Low viscosity

1.Excellent room-temperature stability
2.UL 94 V-0 certified
3.Single component
4.Heat cured
5.High viscosity

1.High thermal conductivity
2.UL 94 V-0 rated
3.Dual component
4.Heat cure
5.Self-leveling

1.Single Component
2.Room-temperature cure
3.Thixotropic paste
4.Low odor and non-corrosive

1.Excellent thermal conductivity
2.Single component
3.Room-temperature cure
4.Thixotropic paste
5.Low odor and non-corrosive

1.MIL-A-46146A Type 1 or MIL-A-46146B 2.Grade 1 Class 2 rated
3.Single component
4.Room-temperature cure
5.Self-leveling
6.Low odor and non-corrosive

Application Scope: Used for potting protection of circuit boards, LED power supplies, waterproof power supplies, automotive electronic modules, electrical appliances, light sources, lamps, and their ancillary components.

Application Scope: Used for insulation and heat dissipation of electronic components, IGB modules, power modules, and printed circuit boards, as well as insulation, waterproofing, moisture-proofing, and potting protection for automotive electrical components.