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KE-210 Dual-component, thermosetting, self-leveling encapsulation potting compound.

KE-1280 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

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Quick Overview

1.UL 94 V-0 certified
2.Dual component
3.Heat cured
4.Self-leveling

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Details

Shin-Etsu's KE-1280 A/B is a UL 94 V-0 rated, dual component, heat cure, self-leveling potting encapsulant that cures to form a durable, flexible rubber to protect electronic components. KE-1280 A/B exhibits excellent, unprimed adhesion to most printed circuit board substrates, metals, plastics, glass, and ceramics.

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Manufacturer Shin-Etsu

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