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KE-45 Dual-component, thermosetting, self-leveling encapsulation potting compound.

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KE-3497 Single-component, room temperature curing, self-leveling adhesive.

KE-3493 Single-component, room temperature curing, rheological adhesive.

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Quick Overview

1.Excellent thermal conductivity
2.Single component
3.Room-temperature cure
4.Thixotropic paste
5.Low odor and non-corrosive

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Details

Shin-Etsu's KE-3493 is a single component, room-temperature cure, thixotropic adhesive that will cure to form a tough, durable elastomer and exhibits excellent thermal conductivity. KE-3493 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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Manufacturer Shin-Etsu

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