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KE-1831 Single-component, thermosetting, high viscosity adhesive.

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KE-45 Dual-component, thermosetting, self-leveling encapsulation potting compound.

KE-1861 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

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Quick Overview

1.High thermal conductivity
2.UL 94 V-0 rated
3.Dual component
4.Heat cure
5.Self-leveling

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Details

Shin-Etsu's KE-1861 A/B is a UL 94 V-0 rated, dual component, heat cure,self-leveling potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-1861 A/B exhibits high thermal conductivity and excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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Manufacturer Shin-Etsu

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