Product was successfully added to your shopping cart.
Previous

KE-1831 Single-component, thermosetting, high viscosity adhesive.

Previous

KE-45 Dual-component, thermosetting, self-leveling encapsulation potting compound.

KE-1861 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

Quick Overview

1.High thermal conductivity
2.UL 94 V-0 rated
3.Dual component
4.Heat cure
5.Self-leveling

Details

Shin-Etsu's KE-1861 A/B is a UL 94 V-0 rated, dual component, heat cure,self-leveling potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-1861 A/B exhibits high thermal conductivity and excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

Additional Information

Manufacturer Shin-Etsu

Product Tags

Use spaces to separate tags. Use single quotes (') for phrases.

  1. Be the first to review this product

Write Your Own Review

How do you rate this product? *

  1 star 2 stars 3 stars 4 stars 5 stars
Quality
Value
Price