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KE-1280 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

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KE-1831 Single-component, thermosetting, high viscosity adhesive.

KE-210 Dual-component, thermosetting, self-leveling encapsulation potting compound.

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Quick Overview

1.Quick deep section cure
2.UL 94 V-0 certified
3.Dual component
4.10:1 mix ratio
5.Room-temperature cure
6.Low viscosity

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Details

Shin-Etsu's KE-210 is a dual component, UL 94 V-0 rated, room-temperature cure, low viscosity potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-210 is mixed with the CAT-210, exhibits excellent electrical insulation and deep section cure, and adhesion to metals, plastics, glass, and ceramics.

Additional Information

Manufacturer Shin-Etsu

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