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Sealing glue 密封胶

   

Items 11 to 20 of 105 total

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  1. 905 Two-Component Addition-Curing Organic Silicone Potting Sealant

    Application Scope: Potting for the PACK of power batteries; thermally conductive potting for reactors; thermally conductive potting for the DC-DC conversion power supply of electric vehicles, waterproof power supply, and thermally conductive potting for lightning protection modules.

  2. 9225 Two-Component Addition-Curing Organic Silicone Potting Sealant

    Application Scope: Used for heat dissipation, moisture-proofing, and potting protection for components such as high-power power supply modules, new energy vehicle power management systems, DC-DC converters, solar electromagnetic devices, etc.

  3. KE-3494 Single-component, room temperature curing, self-leveling adhesive.

    1.UL 94 V-0 certified
    2.Single component
    3.Room-temperature cure
    4.Self-leveling
    5.Low odor and non-corrosive

  4. KE-1204BL A/B Dual-component, thermosetting encapsulation potting compound.

    1.High temperature resistance
    2.Fast cure time
    3.UL 94 V-0 certified
    4.Dual component
    5.1:1 mix ratio
    6.Heat cure
    7.Self-leveling

  5. MOLYKOTE 5 Grease-type Electrical Insulation Distribution

    1.Electrical
    2.Valves, packings, seals & O-rings

  6. MOLYKOTE High Vacuum Grease

    1.Rubber & elastomer lubrication
    2.Vacuum pumps
    3.Valves, packings, seals & O-rings

  7. KE-3467 Self-leveling adhesive.

    1.Superior thermal conductivity
    2.Fast tack free time
    3.UL 94 V-0 certified
    4.Single component
    5.Room-temperature cure
    6.Self leveling
    7.Low odor and non-corrosive

  8. KE-1867 Self-leveling adhesive.

    1.Superior thermal conductivity
    2.UL 94 V-0 certified
    3.Single component
    4.Heat cure
    5.Self-leveling

  9. KE-3490 Rheological adhesive.

    1.UL 94 V-0 certified
    2.Single component
    3.Room-temperature cure
    4.Thixotropic paste
    5.Low odor and non-corrosive

  10. KE-1204 A/B Dual-component, thermosetting encapsulation potting compound.

    1.High temperature resistance (up to 260C intermittent)
    2.Fast cure time
    3.UL 94 V-0 certified
    4.Dual component
    5.1:1 mix ratio
    6.Heat cure
    7.Self-leveling

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Items 11 to 20 of 105 total

  1. 1
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  5. 5