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KE-3494 Single-component, room temperature curing, self-leveling adhesive.

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MOLYKOTE 5 Grease-type Electrical Insulation Distribution

KE-1204BL A/B Dual-component, thermosetting encapsulation potting compound.

Quick Overview

1.High temperature resistance
2.Fast cure time
3.UL 94 V-0 certified
4.Dual component
5.1:1 mix ratio
6.Heat cure
7.Self-leveling

Details

Shin-Etsu's KE-1204BL A/B is a UL 94 V-0 rated, dual component, heat cure, potting encapsulant that will form a durable, flexible rubber to protect electronic components. KE-1204BL A/B exhibits excellent high temperature resistance, electrical isolation, and adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.

Additional Information

Manufacturer Shin-Etsu

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