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Sealing glue 密封胶

   

Items 71 to 80 of 105 total

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  1. DOWSIL 991

    Specially formulated to prevent staining of porous substrates such as natural stone and minimize streaking on metal panels and glass. Forms a durable, flexible, watertight bond with most building materials and can be used for new and remedial construction applications.
  2. DOWSIL SE 9186 L

    One-part, moisture cure RTV, good flow, fast tack-free, controlled volatility.
  3. DOWSIL 1-2577

    One-part, transparent medium viscosity conformal coating with firm, abrasion resistant surface after cure. Conformal Coating suitable for protective coating for rigid and flexible circuit boards and for PCB system Printed Wiring Board (PWB) applications, particularly those requiring toughness and abrasion resistance.
  4. DOWSIL 1-4105

    One-part, clear, fast heat cure, soft, stress-relieving, UL, contains UV indicator. Suitable for use as a protective coating for rigid and flexible circuit boards.
  5. DOWSIL 1-4174

    One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.
  6. DOWSIL 3-1944

    One-part, translucent, moisture RTV, moderate flow, fast tack-free, contains UV indicator, UL 746 and Mil Spec tested.
  7. DOWSIL 3-1965

    One-part, clear, fast moisture RTV cure with mild heat acceleration possible, low viscosity, soft, stress-relieving, contains UV indicator.
  8. DOWSIL 3-6265

    High performance version of 3-6265 adhesive, especially minimizing voids.
  9. 3M 3762 LM Solid, fast-curing hot melt adhesive

    3M™ Hot Melt Adhesive 3762LM is a 100% solid, fast-curing hot melt adhesive designed for packaging and shipping. It is suitable for bonding corrugated cardboard boxes, wood, particle board, plywood, and foam. The recommended application temperature range is 250-270°F (121-132°C).

  10. 3M 3731 High-temperature resistant adhesive


    3M 3731 hot melt adhesive is a highly heat-resistant adhesive that can withstand temperatures up to 265ºF/129ºC without elevating or deforming. It exhibits long-term durability and effectively bonds to various substrates, particularly low surface energy (LSE) materials such as polyethylene and polypropylene, making it an excellent choice for such applications. Additionally, the 3M™ 3731 hot melt adhesive has a fast set time of 30 seconds, delivering strong and resilient bonds in a short period. It offers good peel strength, ensuring durable, convincing, and secure adhesion for a wide range of applications. Use with the 3M™ Hot Melt Applicator EC or 3M™ Hot Melt Applicator TC.

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Items 71 to 80 of 105 total

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  5. 10