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DOWSIL 1-4105

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DOWSIL 3-1944

DOWSIL 1-4174

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Quick Overview

One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.
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Details

One-part, grey, heat cure, thermally conductive, low flow, same as 1-4173 with 7 mil (178 micron) spacer beads, self-priming.

Features:

1.Bonding integrated circuit substrates

2.Adhering lids and housings

3.Base plate attach

4.Heat sink attach

Additional Information

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