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Shin-Etsu KE-109E A/B is an optically transparent, thermosetting, two-component RTV encapsulation adhesive.

KE-1861 A/B

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Quick Overview

Shin-Etsu's KE-1861 A/B is a UL 94 V-0 rated, dual component, heat cure,self-leveling potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-1861 A/B exhibits high thermal conductivity and excellent, unprimed adhesion to metals, plastics, glass, and ceramics.
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Details

Shin-Etsu's KE-1861 A/B is a UL 94 V-0 rated, dual component, heat cure,self-leveling potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-1861 A/B exhibits high thermal conductivity and excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

Product performance：

1.High thermal conductivity

2.UL 94 V-0 rated

3.Dual component

4.Heat cure

5.Self-leveling

Additional Information

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