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Shin-Etsu

   

Items 1 to 10 of 23 total

  1. Shin-Etsu KE-109E A/B is an optically transparent, thermosetting, two-component RTV encapsulation adhesive.

    Shin-Etsu KE-109E A/B is a transparent, thermosetting two-component encapsulation adhesive that cures to form a durable, flexible rubber, making it highly suitable for LED diodes and enhanced LCD displays. KE-109E A/B exhibits excellent electrical insulation properties and demonstrates outstanding adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.

    Product Applications:

    Shin-Etsu KE-106 finds wide applications in electrical insulation, suitable for a broad temperature range. It meets the requirements for bonding, sealing, and fixing various electronic components and mechanical structures, especially those with demands for high/low temperature resistance, aging resistance, shock absorption, buffer, ease of maintenance, and excellent sealing and moisture-proof characteristics. Applications include electrical appliances, solar cells, batteries, hybrid integrated circuits, TC fans and components, electronic products, power systems, sensors, fluorescent lamps, membrane switches, LED display panels, electronic devices, aviation systems, liquid crystal displays, cathode-ray tubes, etc.

  2. SHIN-ETSU KE-3497 Single-component Silicone Rubber Compound

    Shin-Etsu's KE-3497 is a MIL-A-46146 rated, single component, room-temperature cure, self-leveling adhesive that cures to form a tough, durable elastomer. KE-3497 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.
  3. KE-1283 A/B Thermosetting, self-leveling potting compound

    Shin-Etsu's KE-1283 A/B is a UL 94 V-1 rated, dual component, heat cure, self-leveling potting encapsulant that cures to form a durable, flexible rubber to protect electronic components. KE-1283 A/B exhibits excellent, unprimed adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.
  4. KER-2500A/B Dual-component, thermosetting LED encapsulation adhesive.

    1.Excellent refractive index
    2.Dual component
    3.Heat cure
    4.High strength and heat resistance

  5. KE-3493

    Shin-Etsu's KE-3493 is a single component, room-temperature cure, thixotropic adhesive that will cure to form a tough, durable elastomer and exhibits excellent thermal conductivity. KE-3493 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.
  6. KE-3467 Self-leveling adhesive.

    1.Superior thermal conductivity
    2.Fast tack free time
    3.UL 94 V-0 certified
    4.Single component
    5.Room-temperature cure
    6.Self leveling
    7.Low odor and non-corrosive

  7. KE-1056 Single-component, thermosetting encapsulation adhesive based on phenyl-functionalized polysiloxane.

    1.Superior vibration resistance
    2.Excellent electrical insulation
    3.Cold resistance
    4.Single component
    5.Heat cure

  8. KE-3494 Single-component, room temperature curing, self-leveling adhesive.

    1.UL 94 V-0 certified
    2.Single component
    3.Room-temperature cure
    4.Self-leveling
    5.Low odor and non-corrosive

  9. KE-45 Dual-component, thermosetting, self-leveling encapsulation potting compound.

    1.Single Component
    2.Room-temperature cure
    3.Thixotropic paste
    4.Low odor and non-corrosive

  10. KE-1204 A/B Dual-component, thermosetting encapsulation potting compound.

    1.High temperature resistance (up to 260C intermittent)
    2.Fast cure time
    3.UL 94 V-0 certified
    4.Dual component
    5.1:1 mix ratio
    6.Heat cure
    7.Self-leveling

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Items 1 to 10 of 23 total