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Shin-Etsu

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KE-3467 Self-leveling adhesive.

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KE-1056 Single-component, thermosetting encapsulation adhesive based on phenyl-functionalized polysiloxane.

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KE-3494 Single-component, room temperature curing, self-leveling adhesive.

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KE-45 Dual-component, thermosetting, self-leveling encapsulation potting compound.

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KE-1204 A/B Dual-component, thermosetting encapsulation potting compound.

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KE-4918-W Single-component, room temperature curing, rheological adhesive.

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KE-1831 Single-component, thermosetting, high viscosity adhesive.

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KE-1867 Self-leveling adhesive.

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KE-1891 Single-component, thermosetting, rheological adhesive.

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KE-1280 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

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KE-3493 Single-component, room temperature curing, rheological adhesive.

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KE-1285 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

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