HumiSeal®UV20GEL is a fast curing, non-sag thixotropic paste which cures to give a flexible urethane acrylate that bonds well to engineered plastics and metal-based substrates. In addition to the UV cure, this material has a secondary moisture cure mechanism to ensure cure in areas shadowed from UV light. HumiSeal®UV20GEL is designed for staking and vibration dampening applications, but doubles as a high-performance adhesive for general PCB bonding applications.