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AP-9110 Two-Component (Heat-Curing) Epoxy Potting Sealant

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Quick Overview

Application Range: Used for bonding and securing components in automobiles, electrical equipment, motors, signs, lighting fixtures, and artistic products.

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Details

Product Overview: Two-component epoxy resin adhesive, capable of rapid curing at low and room temperatures.
Product Features: Exhibits high transparency and chemical resistance, with high bonding strength and a certain degree of flexibility after curing.

Additional Information

Manufacturer Anpin

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