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DELO KATIOBOND GE680

TC 5021

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Quick Overview

DOWSIL™ TC-5021 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, and notebooks
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Details

DOWSIL™ TC-5021 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of MPU in servers, desktops, and notebooks

Features:

1.Flowable

2.Non-curing material - no need for curing ovens

3.Capable of achieving thin Bond Line Thickness

4.Low thermal resistance

5.High thermal conductivity

6.Conducts heat away from sensitive PCB system assembly components

Additional Information

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