3M LC-3200

3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System

Function:

1.Excellent for semiconductor wafer bonding and debonding with high throughput
2.UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
3.100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
4.Good heat and chemical resistance, easy and clean removal
5.Compatible with typical semiconductor process chemistries and processes
6.Used as part of the 3M™ Wafer Support System