TC 5625C

Dow Corning TC5625C thermal conductivity paste is based on silicone grease, and added high thermal conductivity silicone grease formed thermal conductivity and heat transfer, with excellent thermal and heat transfer effect, there are paste grease, there are both heat conduction and the two functions of the rubber adhesive

Features:

The thermal conductivity material for perfusion of two-component products is standardized gasket form, which is used in intermediate electronic systems such as desktop computers and drawing processing units, and is widely used in electronic parts that generate heat. Such as: transistors, processors, IC systems, etc. DOWCORNINGTC-56252C new thermal grease can provide high thermal conductivity and low cost of ownership for high-end microprocessor packaging Its thermal conductivity is 10% to 15% higher than the current market average thermal grease suitable for a variety of heat sinks