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AP-577 Modified Acrylic Single-Component Room Temperature Curing Coating Adhesive

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Thermal Conductive Gel

Thermally Conductive Phase Change Material

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Quick Overview

Application Scope: Desktops, laptops, and servers; Microprocessors; Chips and chipsets; Graphics cards; Storage modules.

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Details

Product Overview: Thermal phase change materials provide extremely low thermal resistance for the heatsink module between the processor and heatsink of devices such as computers.
Product Features: The material undergoes a phase transition at 50-52℃, exhibiting a certain degree of flowability without overflowing.

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