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KE-1285 A/B Dual-component, thermosetting, self-leveling encapsulation potting compound.

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KE-1891 Single-component, thermosetting, rheological adhesive.

KE-1056 Single-component, thermosetting encapsulation adhesive based on phenyl-functionalized polysiloxane.

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Quick Overview

1.Superior vibration resistance
2.Excellent electrical insulation
3.Cold resistance
4.Single component
5.Heat cure

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Details

Shin-Etsu's KE-1056 is a single component, heat cure, phenyl-based polysiloxane potting gel that will cure to form a soft, pliable elastomer to protect sensitive electronic components. KE-1056 provides superior vibration resistance and exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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Manufacturer Shin-Etsu

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