DOWSIL 3140

Protection of corrosion-sensitive components Protection of rigid and flexible circuit boards Improved pin/solder joint coverage Thin-section encapsulation Pin sealing Features:

1.One-part no mixing required

2.Good flowability, Able to flow, fill or self-leveling after dispensing

3.Room temperature cure, no ovens required

4.Faster in-line processing with optional heat acceleration

5.No added solvents

6.UL 94 V-1, IPC-CC-830 and MIL-A-46146 tested

7.Can be considered for uses requiring added flame resistance, IPC or Mil Spec testing

8.UL 746E / UL746C Recognized

9.UV indicator for manual and automated inspection