3M 3797 Electronic Potting Hot Melt Adhesive

      3M 3797 Hot Melt Adhesive is a high-temperature resistant, low viscosity adhesive that is ideal for effective coverage and protection in small areas, making it particularly suitable for electrical potting. This fully solid thermoplastic adhesive even provides a 30-second open bonding time, making it suitable for deep groove potting as well. The use of the 3M™ PG II Hot Melt Applicator ensures better coating results and is highly suitable for high-volume operations. Hot melt adhesive for electrical potting 3M 3797 Hot Melt Adhesive is a 100% solid thermoplastic low-melting-point adhesive with low viscosity and high-temperature resistance, making it suitable for electrical potting adhesives and other coatings involving electrical and electronic components. It is particularly useful for coatings where protection and long-term stability are crucial. This hot melt adhesive is easy and smooth to flow into small areas, such as on printed circuit boards, after being dispensed, and it cures rapidly. The approximately 30-second open bonding time facilitates effective deep potting, and it enhances efficiency in high-volume operations.

 Function

1. Hot melt adhesive is suitable for potting electrical and electronic components.
2. Low viscosity provides high flow rate for excellent coverage.
3. Ball and ring test - The adhesive exhibits good temperature resistance after application.
4. 30-second open bonding time allows for effective potting in deep grooves.
5. Applying with the 3M PG II hot melt applicator enables rapid production.