TC-5852

TC-5852 silicone grease is a new high-performance thermal compound developed for servers. The thermal grease is formulated from an optimized silicone polymer of thermal filler particles with an overall thermal conductivity of up to 5.2W/MK. It can also achieve a thin interface thickness of about 20 microns due to the surface to achieve a low heat of 0.05--CM2/W. Efficient heat dissipation.

Features:

Single-component material: No curing is required when applying the material. Excellent retention capability: Features unique rheological properties that limit its flow beyond the target interface once assembled. This flow characteristic distinguishes it from low-viscosity thermal COM. Applications that require thicker layers of hot compounds or higher precision provide greater control when distributing compounds between surface interfaces. Thermal stability: Provides consistent performance and reliability at high temperatures. Good processability: Offers low volatile content relative to competitive thermal compounds, allowing for more consistent rheology, application repeatability, and easier screen printing overall"