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Glue RTV

KE-3490

Shin-Etsu KE-3490 is a UL 94 V-0 rated, single component, room-temperature cure, thixotropic adhesive that will cure to form a tough, durable elastomer. KE-3490 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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KE-1204 A/B Two-component Bonding and Sealing Silicone Rubber, Organic Silicone Epoxy Resin

Shin-Etsu's KE-1204 A/B is a UL 94 V-0 rated, dual component, heat cure, potting encapsulant that will form a durable, flexible rubber to protect electronic components. KE-1204 A/B exhibits excellent high temperature resistance, electrical isolation, and adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.

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KE-1285 A/B

Shin-Etsu's KE-1285 A/B is a UL V-0 rated, dual component, heat cure, self-leveling potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-1285 A/B exhibits high thermal conductivity, excellent electrical isolation, and excellent, unprimed adhesion to printed circuit boards, metals, plastics, glass, and ceramics.

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KE-1056

Shin-Etsu's KE-1056 is a single component, heat cure, phenyl-based polysiloxane potting gel that will cure to form a soft, pliable elastomer to protect sensitive electronic components. KE-1056 provides superior vibration resistance and exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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KE-1891

Shin-Etsu's KE-1891 is a UL 94 V-0 rated, single component, heat cure, thixotropic adhesive that will cure to form a tough, durable elastomer. KE-1891 exhibits superior thermal conductivity and excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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KE-4901-W

Shin-Etsu's KE-4901 is a UL 94 V-0 rated, single component, room-temperature cure, thixotropic adhesive that will cure into a tough, durable elastomer and exhibits high thermal conductivity. KE-4901 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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KE-4918-W

Shin-Etsu's KE-4918-W is a UL 94 V-0 rated, single component, room-temperature cure, thixotropic adhesive that will cure to form a tough, durable elastomer and exhibits high thermal conductivity. KE-4918-W is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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KE-1204BL A/B

Shin-Etsu's KE-1204BL A/B is a UL 94 V-0 rated, dual component, heat cure, potting encapsulant that will form a durable, flexible rubber to protect electronic components. KE-1204BL A/B exhibits excellent high temperature resistance, electrical isolation, and adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.

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KE-3494

Shin-Etsu's KE-3494 is a UL 94 V-0 rated, single component, room-temperature cure, self-leveling adhesive that will cure to form a tough, durable elastomer. KE-3494 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics.

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KE-1280 A/B

Shin-Etsu's KE-1280 A/B is a UL 94 V-0 rated, dual component, heat cure, self-leveling potting encapsulant that cures to form a durable, flexible rubber to protect electronic components. KE-1280 A/B exhibits excellent, unprimed adhesion to most printed circuit board substrates, metals, plastics, glass, and ceramics.

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