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  • DELO   MONOPOX DA2258 DELO   MONOPOX DA2258
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DELO MONOPOX DA588

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DELO MONOPOX EG2596

DELO MONOPOX DA2258

Quick Overview

free of solvents | low-temperature-curing from + 60 °C, filled, thixotropic

Details

free of solvents | low-temperature-curing from + 60 °C, filled, thixotropic

Special features of product:
▪ compliant with RoHS Directive 2015/863/EU
▪ halogen-free according to IEC 61249-2-21
▪ compliant with limits of VOC content in adhesive
acc. to GB33372-2020
Function
▪ die attach adhesive
▪ electronic adhesive
Typical area of use
▪ -40 - 150 °C
▪ chip bonding
▪ bonding of temperature-sensitive substrates

Additional Information

Manufacturer No

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