Adhesive 胶黏剂

free of solvents, free of antimony | low-temperature-curing from + 60 °C, heat curing mandatory,
light-fixable, tension-equalizing, flow-resistant, filled, light-blocking, thixotropic

free of solvents | heat curing mandatory, light-fixable, low-temperature-curing, low outgassing, fast
fixation

free of solvents | low-temperature-curing, low CTE, humidity-resistant, dual-curing, light-fixable, low
outgassing, filled, low swelling, reproducible, low shrinkage, fast fixation

free of solvents, free of bisphenol A, free of nonylphenols, free of CFC / CHC | low-temperaturecuring, low CTE, humidity-resistant, electrically insulating, no corrosive effect, very high temperature
strength, flow-resistant, low blooming and odorless, dual-curing, light-fixable, low outgassing, filled,
low swelling, high-strength, high ion purity, reproducible, low shrinkage, fast fixation, thixotropic

free of solvents, free of antimony | low-temperature-curing, low CTE, humidity-resistant, flowresistant, dual-curing, light-fixable, low outgassing, filled, low swelling, reproducible, low shrinkage,
fast fixation

modified polycarbamin acid derivate | 1C | light-fixable / heat-curing
free of solvents | heat curing mandatory, light-fixable, low-temperature-curing, unfilled

free of solvents | filled | light-fixable

free of solvents | heat curing mandatory, light-fixable, low-temperature-curing, filled

free of solvents | heat curing mandatory, light-fixable, low-temperature-curing, filled

free of solvents | dual-curing, thixotropic, unfilled